Bruker TriboLab CMP
Nano Surfaces
R&D-scale process and material characterization system.
The Bruker TriboLab CMP tribometer is specifically for cost-effective characterisation of wafer polishing processes in research and development

Benefits
Flexible
parameter control
Unmatched
ROI in a small-scale R&D system
Reproduce full-scale
wafer polishing-process conditions
Test small coupons
instead of whole wafers for substantial cost savings
Details
Leveraging over 20 years of CMP characterization expertise with its predecessor product (Bruker CP-4), TriboLab CMP brings a complete set of capabilities to the industry-leading TriboLab platform. The resulting accuracy and measurement repeatability enables the highly effective qualification, inspection, and ongoing functionality testing required throughout the CMP process. TriboLab CMP is the only process development tool on the market that can provide a broad range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for accurate and complete characterization of CMP processes and consumables.
- Reproduces full-scale wafer polishing process conditions without downtime on production equipment
- Provides unmatched measurement repeatability and detail
- Allows testing on small coupons for substantial cost savings over whole-wafer testing
TriboLab CMP Gallery
TriboLab CMP Photos
Get in Touch
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