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Posts Tagged ‘bruker hysitron’

Semiconductor wafer

Characterising CMP Pads with Nanoindentation

How to use dynamic nanoindentation characterise CMP pads. In this example, the Bruker Hysitron TS 77 Select was employed to quantitatively measure the viscoelastic properties of a hard pad.

This is a robust, reliable method for examining CMP pad surface quality and processes.

Scientific Nanoscale Analysis Podcast

“Solutions for NanoAnalysis” Podcast

A new nanoanalysis podcast from Bruker, with special guests from all areas of nanoscale analysis including micro-XRF, TXRF, nanomechanical testing, TEM/SEM and more.

In-Situ Material Deformation Testing

In-Situ Nanomechanical Test System for Analysing Material Deformation in SEM

The new Bruker Hysitron PI 89 SEM PicoIndenter is an in-situ nanomechanical testing system for electron microscopes, for analysing deformation of high-strength materials.

Nanobruecken 2020

Nanobrücken 2020: Nanomechanical Testing Conference & Bruker Hysitron User Meeting

Register now for Bruker Hysitron’s nanomechanicel testing conference and user meeting on 4-6 February 2020 in Düsseldorf, Germany.

Combining Indentation & Raman

Combining Raman Spectroscopy and Nanoindentation

How to combine Raman and nanoindentation for correlated mechanical and chemical data, delivering insights into your material’s properties.

In-Situ Compression Testing

Webinar: In-Situ Nanomechanics in the Transmission Electron Microscope (TEM) 18/10/18

Join Bruker for a webinar on 18 October 2018 about in-situ nanomechanical testing in the TEM, including how to observe materials under stress at the nanoscale.

Nanomechanical Testing with In Situ SPM

In Situ SPM for Nanomechanical and Nanotribological Characterisation

Nanomechanical testing with in situ SPM imaging, using the same probe to ensure test positioning accuracy and correlated results.