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Cross Section Kit


Cross Section Kit

XTEM Sample Preparation 

Gatan Cross Section Kit for quickly and easy sample preparation, ready for XTEM (cross sectional transmission electron microscopy) of semiconductor devices, thin films of various substrates and composites.

  • Study of interfaces with greater consistency
  • Use with the Ultrasonic Cutter: cut rectangular areas of interest from bulk material to produce coated, stacked and pressure-cured sections with minimum glue thickness (<1 µm)
  • Prepare cylinder sections for dimpling prior to ion milling

Contact us for a data sheet with details about how to prepare:

  • Simple cross sections
  • Cross sectional TEM discs
  • Metals and hard materials
  • Precision cross sections
  • Powders and fibres

Contact us for more information and quotes:
+44 (0)1223 422 269 or info@blue-scientific.com

XTEM Cross Section Kit



  • Semiconductors
  • Thin films
  • Composites


  • Consistent sample preparation
  • Quick and easy

PIPS cross section sample

Cross section of a semi-processed IC device. Note the well-aligned features on both wafers.