Cross Section Kit
XTEM Sample Preparation
Gatan Cross Section Kit for quickly and easy sample preparation, ready for XTEM (cross sectional transmission electron microscopy) of semiconductor devices, thin films of various substrates and composites.
- Study of interfaces with greater consistency
- Use with the Ultrasonic Cutter: cut rectangular areas of interest from bulk material to produce coated, stacked and pressure-cured sections with minimum glue thickness (<1 µm)
- Prepare cylinder sections for dimpling prior to ion milling
Contact us for a data sheet with details about how to prepare:
- Simple cross sections
- Cross sectional TEM discs
- Metals and hard materials
- Precision cross sections
- Powders and fibres
Contact us for more information and quotes:
+44 (0)1223 422 269 or info@blue-scientific.com
Cross section of a semi-processed IC device. Note the well-aligned features on both wafers.
