New Bruker TriboLab CMP for Small-Scale Wafer Polishing Characterisation

The Bruker TriboLab CMP is a new system for small-scale Chemical Mechanical Wafer Polishing in R&D. It reproduces full-scale wafer polishing process conditions with unique characterisation features. This is a new, updated system replacing the previous CP-4.

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Bruker Nano Surface analysis instruments

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Bruker CP-4 for wafer R&D

TriboLab CMP

The TriboLab CMP Process and Material Characterisation system provides unique characterisation capabilities, for developing chemical mechanical polishing (CMP) processes. The system is based on Bruker’s established UMT TriboLab™ mechanical testing platform.

Unique Capabilities

The TriboLab CMP is the only system available with all these features, for the accurate and complete characterisation of CMP processes and consumables:

  • A broad range of polishing pressures (0.05-50 psi)
  • Range of speeds (1 to 500 rpm)
  • Friction
  • Acoustic emissions
  • Surface temperature measurements

Bruker TriboLab CMP

CMP is more critical than ever for advanced semiconductor device fabrication. The industry has been calling for a means to effectively characterise the detailed process and consumables interactions that take place while polishing a wide range of materials. We are pleased to partner with Bruker and assist in the launch of the TriboLab CMP platform. With the addition of this new system to our capabilities, we are poised to provide a reliable R&D solution for testing and characterisation of complex interactions among pads, slurries, conditioning, and process parameters with unmatched repeatability and detail.
Dr. Robert Rhoades, CTO of Entrepix, a leading provider of equipment and wafer processing services to the CMP industry
Bruker has supplied instruments for this application for well over a decade, and we are delighted to introduce TriboLab CMP as the latest generation product of this family. TriboLab CMP has already demonstrated superior capabilities at customer sites on some of the most challenging CMP applications development in the semiconductor industry. It is the only tool on the market that can provide the broad polishing pressure and speed ranges, acoustic emission data, friction, and surface temperature for accurate and complete characterisation of CMP processes and consumables.
James Earle, Vice President and General Manager of Bruker Tribology, Stylus and Optical Metrology

Detailed Data from Small-Scale Tests

The TriboLab CMP system delivers highly accurate and repeatable measurements. These are valuable throughout the CMP process, for qualification, inspection and ongoing functionality testing.

By performing tests on small coupons rather than full-scale whole-wafer measurements, you can reduce costs substantially.

Data is collected throughout the entire test from the moment the substrate touches the pad. Make early-stage process development decisions with complete, detailed data.

On-board diagnostics are provided as standard. Understand your polishing processes more clearly, with enhanced visibility into transient polishing properties.

Further Information

Blue Scientific is the official Nordic distributor of the TriboLab CMP. For more information, or if you have any questions, please get in touch:

Bruker TriboLab CMP

 Contact us on +44 (0)1223 422 269 or


Testing conditioning discs

Testing Conditioning Discs on CMP Tester. Tests identify two groups of discs. Friction coefficient tests correlate with pad wear.